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S0MCF2PC FC6155 2N540 520003 05DB2 8ETU04 50110 ZMY75
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  Datasheet File OCR Text:
 IA
Features

NT
HIGH PERFORMANCE TERMINATION NETWORK Miniaturized circuitry and packaging for space reduction Designed for gigabit communication networks
CO
M

*R
oH
Controlled impedance RoHS compliant*
S
PL
CAT16-LV4F12 - Concave Chip Array
Electrical Characteristics
Resistance R1 .............................................165 ohms R2 .............................................140 ohms Tolerance ............................................1 % TCR........................................200 ppm/ C Temperature Range .........-55 C to +125 C Max. Operating Voltage ....................5 VDC Max. Power Resistance ................ .0625 W Solderability .....................>95 % Coverage
Product Dimensions
16 15 14 13 12 11 10 9
.60 .10 (.024 .004) 1.60 .15 (.063 .060)
.45 .10 (.018 .004)
.30 .10 DIA. (.012 .004)
.40 .10 (.016 .004) .40 .10 (.016 .004)
.80 .10 (.031 .004)
For Standard Values Used in Capacitors, Inductors, and Resistors, click here.
1
DIMENSIONS ARE: MM (INCHES)
2
3
6.40 .15 (.253 .006)
4
5
6
7
8
Packaging Specifications
4000 pcs - per 7 " reel
0.9 0.1 (.035 .004) 2.00 0.20 (.079 .008) 4.0 .10 (.157 .004)
2.0 .05 (.079 .002)
13 0.5 DIA. (.512 .020) 60.0 1.0 DIA. (2.36 .039) 12.0 0.2 (.472 .008) 21 0.5 (.827 .020) 12.5 2 (.492 .079) 10.0 1.5 (.394 .059) 178.0 2.0 (7.008 .080)
6.9 0.2 (.272 .008)
5.5 0.1 (.217 .004)
4.0 .10 (.158 .004)
1.5 +.10/-0 (.060 +.004/-0)
1.75 .10 (.069 .004)
Derating Curve
Rated power in percentage (%)
Land Pattern
Solder resist
100 80 60 40 20 0 -55 0 70 (C) Ambient temperature 125
0.7 to 0.9 (.028 to .035)
Land
Chip resistor array CAT 2.0 to 2.2 (.079 to .087)
0.4 to 0.45 (.016 to .0178)
0.80 (.032)
Schematic
16
R2 R1 R1 R1
15
14
R2
13
12
R2 R1
11
10
R2 R1 R1
9
R1
R1
1
2
3
4
5
6
7
8
REV. 05/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.


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